job description
Join Infineon Technologies, a global leader in semiconductor solutions, and become a key player in shaping the future of advanced package technology development. As a Staff/Senior Staff Engineer in our cutting-edge team, you will drive innovation in semiconductor packaging, enabling next-generation electronic devices that power industries from automotive to IoT.
This role offers a unique opportunity to merge your technical expertise with creativity, working on groundbreaking projects that push the boundaries of technology. Based in Bali, Indonesia (with options in Canggu, Ubud, Denpasar, Jimbaran, Nusa Dua, Kuta, or Badung), youâll collaborate with a diverse, international team of experts while enjoying a dynamic work environment that fosters growth and innovation.
At Infineon, we value forward-thinking professionals who are passionate about solving complex challenges. If you thrive in a fast-paced, collaborative setting and want to make a tangible impact on the future of electronics, this is the role for you. Apply now and take the next step in your engineering career with a company that invests in your success.
Responsibility
- Lead the development and optimization of advanced semiconductor packaging technologies, ensuring alignment with industry standards and Infineonâs strategic goals.
- Design and implement innovative packaging solutions for high-performance electronic devices, focusing on reliability, thermal management, and miniaturization.
- Collaborate with cross-functional teams, including R&D, manufacturing, and quality assurance, to drive seamless integration of new technologies into production.
- Conduct feasibility studies, simulations, and prototyping to evaluate new materials, processes, and design concepts for package development.
- Identify and mitigate technical risks in packaging projects, ensuring compliance with industry regulations and customer requirements.
- Mentor junior engineers and provide technical guidance to support their professional growth and project success.
- Stay abreast of emerging trends in semiconductor packaging and propose innovative solutions to maintain Infineonâs competitive edge.
- Document and present technical findings, project progress, and recommendations to stakeholders and leadership teams.
Qualifications
- Bachelorâs, Masterâs, or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- Minimum of 8+ years of experience in semiconductor packaging technology development, with a proven track record in advanced packaging solutions.
- Strong expertise in package design, materials selection, thermal analysis, and reliability testing for semiconductor devices.
- Proficiency in CAD tools (e.g., AutoCAD, SolidWorks), simulation software (e.g., ANSYS, COMSOL), and package characterization techniques.
- Hands-on experience with wafer-level packaging (WLP), flip-chip, 3D packaging, or system-in-package (SiP) technologies is highly desirable.
- Excellent problem-solving skills with the ability to analyze complex technical challenges and propose effective solutions.
- Strong communication and collaboration skills, with the ability to work effectively in a global, multicultural team environment.
- Fluency in English; additional languages are a plus.