job description
Join People Profilers as a Senior/Staff Lithography Process Engineer and lead cutting-edge semiconductor packaging innovation in Singapore. This is a unique opportunity for experienced engineers to drive lithography process development in a dynamic, high-tech environment. Work pass sponsorship is available for qualified Malaysian candidates.
As a key member of our engineering team, you will spearhead advanced lithography solutions, optimizing processes to enhance yield, performance, and reliability in semiconductor manufacturing. Your expertise will directly impact next-generation packaging technologies, contributing to breakthroughs in the industry.
Based in Singapore’s thriving tech hub, this role offers a competitive salary (SGD 6,000–8,000/month), career growth, and the chance to work with global leaders in semiconductor innovation. If you’re passionate about pushing the boundaries of lithography and process engineering, we want to hear from you.
Responsibility
- Lead the development, optimization, and troubleshooting of lithography processes for advanced semiconductor packaging.
- Collaborate with cross-functional teams (R&D, manufacturing, quality) to enhance process efficiency and yield.
- Design and execute DOE (Design of Experiments) to improve lithography performance and resolve technical challenges.
- Monitor and analyze process data using SPC (Statistical Process Control) to ensure consistency and quality.
- Develop and implement new lithography materials, tools, and methodologies to meet evolving industry standards.
- Provide technical guidance to junior engineers and technicians, fostering a culture of innovation.
- Work closely with equipment vendors to evaluate and integrate new lithography systems.
- Document processes, procedures, and best practices to ensure compliance and knowledge sharing.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Chemical Engineering, Materials Science, or related fields.
- Minimum 5+ years of experience in lithography process engineering within semiconductor manufacturing or packaging.
- Hands-on experience with photolithography tools, resist materials, and process optimization.
- Strong knowledge of semiconductor packaging technologies (e.g., Wafer-Level Chip Scale Packaging, Fan-Out, etc.).
- Proficiency in data analysis tools (JMP, Python, MATLAB) and SPC methodologies.
- Excellent problem-solving skills with a track record of improving process yields and reliability.
- Familiarity with cleanroom protocols, safety standards, and ISO/TS certifications.
- Strong communication and leadership skills to drive cross-functional collaboration.