job description
Join Infineon Technologies as a Senior Staff Engineer in Unit Process Development (Plating) and lead cutting-edge initiatives in semiconductor manufacturing. Based in the vibrant hub of Denpasar, Bali, you will drive the development, optimization, and qualification of plating processes to deliver high-performance, cost-effective, and scalable solutions for next-generation electronic components.
In this pivotal role, you will collaborate with cross-functional teams to innovate plating techniques, ensuring alignment with Infineon’s commitment to quality, efficiency, and sustainability. Your expertise will directly impact the production of advanced semiconductor devices, powering industries from automotive to IoT.
This is a unique opportunity to shape the future of microelectronics while enjoying the dynamic work-life balance of Bali—a global hotspot for tech talent and innovation.
Responsibility
- Lead the development, optimization, and qualification of plating processes for semiconductor manufacturing, ensuring compliance with industry standards and Infineon’s quality benchmarks.
- Design and execute DOE (Design of Experiments) to analyze process variables, improve yield, and reduce defects in plating operations.
- Collaborate with R&D, production, and quality assurance teams to integrate new plating technologies into high-volume manufacturing.
- Develop and maintain process documentation, SOPs, and work instructions to ensure consistency and reproducibility across global sites.
- Drive cost-reduction initiatives by optimizing material usage, cycle times, and equipment efficiency without compromising performance.
- Troubleshoot complex plating-related issues, applying root-cause analysis (RCA) and implementing corrective actions.
- Mentor junior engineers and technicians, fostering a culture of continuous improvement and technical excellence.
- Stay abreast of emerging trends in plating technologies (e.g., electroless plating, PVD/CVD) and assess their applicability to Infineon’s product roadmap.
Qualifications
- Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Electrical Engineering, or a related field. PhD is a plus.
- Minimum 8+ years of experience in semiconductor process development, with a focus on plating (electroplating, electroless plating, or immersion plating).
- Proven track record in process optimization, DOE, and statistical analysis (e.g., JMP, Minitab).
- Deep understanding of semiconductor fabrication, including cleanroom protocols, metrology (e.g., SEM, XRD, AFM), and defect analysis.
- Experience with equipment qualification, SPC (Statistical Process Control), and FMEA (Failure Mode and Effects Analysis).
- Strong project management skills, with the ability to lead cross-functional initiatives under tight deadlines.
- Excellent communication and stakeholder management skills, with fluency in English.
- Familiarity with ISO/TS 16949, IATF 16949, or other automotive/industrial quality standards is advantageous.