job description
Join AT&S, a global leader in advanced semiconductor packaging and high-end PCB solutions, as a Senior Simulation Engineer in our dynamic team based in Bali, Indonesia. In this pivotal role, you will drive innovation by performing cutting-edge thermo-mechanical simulations to assess product reliability, identify failure mechanisms, and optimize designs for next-generation electronic components.
Leveraging advanced CAE tools (e.g., ANSYS, ABAQUS, or COMSOL), you will collaborate with cross-functional teamsāincluding R&D, manufacturing, and quality assuranceāto enhance product performance, reduce time-to-market, and ensure compliance with industry standards. Your expertise will directly contribute to the development of high-reliability solutions for automotive, industrial, and consumer electronics applications.
This is a unique opportunity to work in a fast-paced, international environment where your analytical skills and technical insights will shape the future of electronic packaging. If you are passionate about simulation-driven engineering and thrive in a collaborative setting, we invite you to apply and be part of our mission to deliver excellence in technology.
Responsibility
- Develop and execute finite element analysis (FEA) and computational fluid dynamics (CFD) simulations to evaluate thermo-mechanical behavior of electronic packages and PCBs.
- Identify potential failure modes (e.g., solder joint fatigue, warpage, delamination) and propose design or material improvements to mitigate risks.
- Collaborate with R&D and production teams to validate simulation results through DOE (Design of Experiments) and physical testing.
- Create and maintain simulation models, libraries, and documentation to ensure reproducibility and knowledge sharing.
- Support root-cause analysis (RCA) for field failures or manufacturing defects using simulation data and empirical evidence.
- Stay abreast of industry trends in advanced packaging (e.g., fan-out, 2.5D/3D ICs) and integrate new methodologies into simulation workflows.
- Optimize product designs for thermal management, mechanical robustness, and cost-effectiveness.
- Present technical findings and recommendations to stakeholders through clear reports and presentations.
Qualifications
- Bachelorās or Masterās degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field. PhD is a plus.
- Minimum 5 years of experience in thermo-mechanical simulation for electronics, semiconductor packaging, or PCB industries.
- Proficiency in FEA/CFD tools such as ANSYS Mechanical, ABAQUS, COMSOL, or similar.
- Strong understanding of material properties (e.g., CTEs, elastic/plastic behavior, viscoelasticity) and failure mechanisms in electronic components.
- Experience with scripting/automation (Python, MATLAB, or similar) for pre/post-processing simulation data.
- Familiarity with industry standards (e.g., JEDEC, IPC, AEC-Q200) and reliability testing methodologies.
- Excellent problem-solving skills and the ability to work in a multidisciplinary team.
- Fluency in English (written and verbal) is mandatory; additional languages are a plus.