job description
Join the Agency for Science, Technology and Research (A*STAR) as a Senior Scientist II specializing in Advanced RF Packaging and Integration. This is a unique opportunity to lead groundbreaking research and development in next-generation RF technologies, contributing to cutting-edge innovations in wireless communication, IoT, and beyond.
Based in the vibrant and inspiring setting of Bali, you will collaborate with a multidisciplinary team of experts to push the boundaries of RF packaging solutions. Your work will directly impact the future of high-performance electronic devices, ensuring seamless integration and optimal functionality.
If you are passionate about advancing technology and thrive in a dynamic, research-driven environment, we invite you to apply and be part of our mission to shape the future of RF engineering.
Responsibility
- Lead research and development initiatives in advanced RF packaging and integration techniques.
- Design, simulate, and test high-frequency RF modules and systems for next-generation applications.
- Collaborate with cross-functional teams to optimize RF performance, reliability, and manufacturability.
- Develop innovative solutions for miniaturization, thermal management, and signal integrity in RF packaging.
- Conduct feasibility studies and prototype testing to validate new concepts and technologies.
- Publish research findings in peer-reviewed journals and present at international conferences.
- Mentor junior scientists and engineers, fostering a culture of innovation and continuous learning.
- Stay abreast of industry trends and emerging technologies to drive strategic R&D directions.
Qualifications
- PhD in Electrical Engineering, Materials Science, or a related field with a focus on RF/microwave engineering.
- Minimum of 5 years of experience in RF packaging, integration, or related areas.
- Proven expertise in RF design tools (e.g., Ansys HFSS, CST Microwave Studio, ADS).
- Strong background in electromagnetic simulation, signal integrity analysis, and thermal management.
- Experience with semiconductor packaging technologies (e.g., flip-chip, wafer-level packaging, 3D integration).
- Excellent analytical, problem-solving, and project management skills.
- Strong communication skills with a track record of publishing research and presenting at conferences.
- Ability to work independently and collaboratively in a fast-paced research environment.