job description
Join STATS ChipPAC, a global leader in advanced semiconductor packaging and test solutions, as we pioneer the next generation of microelectronics innovation. We are seeking a Senior R&D Engineer specializing in Thermal Compression Bonding (TCB) and Chip Assembly (C/A) to drive the development and optimization of cutting-edge bonding processes for high-performance semiconductor devices.
In this role, you will lead cross-functional teams to enhance process efficiency, reliability, and scalability for next-gen packaging technologies. Your expertise will directly impact the performance of advanced chips used in AI, 5G, automotive, and IoT applications. Based in the vibrant Badung region of Bali, you’ll work in a dynamic environment that blends innovation with a collaborative, forward-thinking culture.
If you are passionate about pushing the boundaries of semiconductor engineering and thrive in a fast-paced R&D setting, this is your opportunity to make a lasting impact in the tech industry.
Responsibility
- Lead the research, development, and optimization of Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging.
- Design and execute DOE (Design of Experiments) to improve bonding yield, reliability, and thermal performance.
- Collaborate with process, equipment, and material engineering teams to integrate TCB solutions into high-volume manufacturing.
- Develop and validate new bonding materials, tooling, and process parameters for next-generation chip assembly.
- Analyze failure modes and implement corrective actions to enhance process robustness and product quality.
- Author technical reports, patents, and whitepapers to document innovations and best practices.
- Stay abreast of industry trends in semiconductor packaging (e.g., hybrid bonding, Cu-Cu bonding, microbump) and propose R&D initiatives.
- Mentor junior engineers and provide technical leadership in cross-functional project teams.
Qualifications
- Bachelor’s or Master’s degree in Materials Science, Electrical Engineering, Mechanical Engineering, or related fields.
- 5+ years of experience in semiconductor packaging R&D, with a focus on Thermal Compression Bonding (TCB), flip-chip, or chip assembly.
- Hands-on experience with bonding equipment (e.g., SET, Kulicke & Soffa, ASMPT) and process characterization tools (SEM, AFM, X-ray).
- Strong knowledge of material properties (e.g., solder alloys, underfill, die attach films) and their impact on bonding performance.
- Proficiency in statistical analysis (JMP, Minitab) and DOE methodologies for process optimization.
- Experience with failure analysis techniques (cross-section, EDX, CSAM) and reliability testing (HTOL, TC, drop test).
- Excellent problem-solving and project management skills with a track record of delivering R&D projects to production.
- Fluency in English (written and verbal) with strong technical communication skills.