job description
Join STATS ChipPAC, a global leader in advanced semiconductor packaging and test solutions, as a Senior R&D Engineer specializing in Underfill and Cure Processes. In this pivotal role, you will drive innovation in high-density packaging by designing, qualifying, and optimizing cutting-edge underfill materials and curing methodologies to enhance reliability, thermal performance, and manufacturing efficiency.
Based in the vibrant and dynamic region of Bali, Indonesia, you will collaborate with cross-functional teams to develop next-generation solutions for semiconductor applications. This is a unique opportunity to contribute to groundbreaking advancements in microelectronics while enjoying the work-life balance of one of the world’s most sought-after destinations.
If you are passionate about materials science, process engineering, and pushing the boundaries of technology, we invite you to apply and be part of a team that shapes the future of semiconductor packaging.
Responsibility
- Lead the design, development, and optimization of advanced underfill processes for high-density semiconductor packaging, including capillary flow, no-flow, and molded underfill technologies.
- Conduct experimental testing and characterization of underfill materials to evaluate adhesion, thermal conductivity, mechanical strength, and reliability under various environmental conditions.
- Collaborate with cross-functional teams (Process, Quality, and Manufacturing) to integrate underfill solutions into high-volume production, ensuring scalability and cost-effectiveness.
- Develop and validate cure process parameters (temperature, time, pressure) to achieve optimal material properties and minimize defects such as voids or delamination.
- Utilize DOE (Design of Experiments) and statistical analysis to identify key process variables and improve yield and performance.
- Author technical reports, patents, and white papers to document innovations and contribute to industry standards.
- Stay abreast of emerging trends in underfill materials (e.g., epoxy, silicone, hybrid polymers) and curing technologies (UV, thermal, microwave).
- Provide technical guidance and mentorship to junior engineers and technicians, fostering a culture of continuous improvement.
Qualifications
- Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, or a related field. A PhD is a plus.
- 5+ years of experience in semiconductor packaging, specifically in underfill process development, material selection, and cure optimization.
- Hands-on experience with underfill dispensing systems, reflow soldering, and encapsulation processes in a high-volume manufacturing environment.
- Proficiency in material characterization techniques (DSC, TGA, DMA, SEM, FTIR) and reliability testing (temperature cycling, drop test, HAST).
- Strong knowledge of statistical process control (SPC) and data analysis tools (JMP, Minitab, Python, or R).
- Familiarity with industry standards (JEDEC, IPC) and failure analysis methodologies.
- Excellent problem-solving and project management skills, with a track record of delivering innovative solutions under tight deadlines.
- Effective communication and teamwork abilities, with fluency in English (written and verbal).