job description
Join Carsem, a global leader in semiconductor packaging and test solutions, as a Senior Project Management Engineer in beautiful Bali. This is a unique opportunity to drive cutting-edge projects from Request for Quotation (RFQ) through development to pre-production, ensuring seamless transition into full-scale manufacturing.
In this dynamic role, you will collaborate with cross-functional teams to deliver high-precision engineering solutions that meet stringent quality and timeline requirements. Your expertise will directly impact our ability to innovate and maintain our position as a trusted partner to the worldâs leading semiconductor companies.
Based in Denpasar, Bali, youâll enjoy a vibrant work-life balance while contributing to groundbreaking projects in a fast-paced, technology-driven environment. Whether you're optimizing processes, mitigating risks, or leading project milestones, your work will shape the future of semiconductor manufacturing.
Responsibility
- Lead end-to-end project management for semiconductor packaging and test initiatives, from RFQ to mass production.
- Develop and maintain detailed project plans, timelines, and budgets, ensuring alignment with business objectives.
- Coordinate with R&D, engineering, procurement, and production teams to ensure seamless project execution.
- Identify and mitigate project risks, implementing contingency plans to maintain schedule and quality standards.
- Monitor project progress, providing regular status updates to stakeholders and senior management.
- Drive continuous improvement by analyzing project performance and implementing best practices.
- Ensure compliance with industry standards (e.g., ISO, IATF) and customer-specific requirements.
- Facilitate cross-functional communication to resolve technical and logistical challenges.
Qualifications
- Bachelorâs degree in Electrical Engineering, Mechanical Engineering, Industrial Engineering, or a related field. Masterâs degree is a plus.
- Minimum 5 years of experience in project management within semiconductor, electronics manufacturing, or a high-tech industry.
- Proven track record of managing complex projects with budgets exceeding $1M and timelines of 12+ months.
- Strong proficiency in project management tools (e.g., MS Project, Primavera, JIRA) and methodologies (e.g., Agile, Waterfall, PMP).
- Excellent analytical, problem-solving, and decision-making skills with a data-driven approach.
- Familiarity with semiconductor packaging processes (e.g., QFN, BGA, Wafer Level Packaging) is highly advantageous.
- Exceptional communication and stakeholder management skills, with fluency in English.
- PMP, PRINCE2, or Six Sigma certification is a strong plus.