job description
Join Micron Semiconductors, a global leader in memory and storage solutions, as a Senior Product Engineer specializing in High Bandwidth Memory (HBM) Health and Reliability. This is a unique opportunity to work remotely from the vibrant tech hubs of Bali, Indonesia, contributing to next-generation memory technologies that power AI, data centers, and high-performance computing.
In this role, you will drive the reliability engineering for Micronâs cutting-edge HBM products, ensuring they meet the highest standards of performance, durability, and longevity. Your expertise will directly impact the success of mission-critical applications in cloud computing, graphics, and enterprise systems. Collaborate with cross-functional teams to innovate, test, and optimize memory solutions that push the boundaries of whatâs possible.
If you are passionate about semiconductor technology, thrive in a dynamic environment, and want to make a tangible impact in the tech industry, this is your chance to shine with a Fortune 500 company that values innovation, diversity, and excellence.
Responsibility
- Lead reliability testing and validation for HBM (High Bandwidth Memory) products, including stress testing, failure analysis, and lifetime predictions.
- Develop and implement reliability models and accelerated test methodologies to ensure product robustness under real-world conditions.
- Collaborate with design, process, and manufacturing teams to identify and mitigate potential reliability risks in HBM architectures.
- Analyze field data and customer feedback to drive continuous improvements in product reliability and performance.
- Author and present technical reports and reliability assessments for internal stakeholders and customers.
- Mentor junior engineers and provide technical leadership in reliability engineering best practices.
- Stay ahead of industry trends in memory technology, AI/ML workloads, and data center demands to inform product roadmaps.
- Work closely with quality assurance and failure analysis teams to root-cause and resolve reliability issues.
Qualifications
- Bachelorâs or Masterâs degree in Electrical Engineering, Materials Science, Computer Engineering, or a related field.
- 5+ years of experience in semiconductor reliability engineering, with a focus on memory products (DRAM, HBM, or similar).
- Deep understanding of HBM architecture, packaging, and thermal management challenges.
- Hands-on experience with reliability testing tools (e.g., HTOL, THB, temperature cycling, ESD) and failure analysis techniques (SEM, FIB, EDX).
- Proficiency in data analysis and statistical modeling (Python, JMP, or R preferred).
- Strong problem-solving skills and ability to work in a fast-paced, collaborative environment.
- Excellent communication and presentation skills to articulate complex technical concepts to diverse audiences.
- Familiarity with JEDEC standards and industry reliability benchmarks is a plus.