job description
Join MTC Consulting Pte. Ltd. as a Senior Process Engineer (Semiconductor Plating) in the vibrant heart of Bali, Indonesia. This is a unique opportunity to leverage your expertise in semiconductor manufacturing while enjoying the island’s dynamic work-life balance. With a competitive base salary of $4,000–$4,700/month, plus performance bonuses, yearly increments, and comprehensive benefits including medical, dental, and transport allowances, this role offers both professional growth and personal fulfillment.
As a key player in our engineering team, you will drive innovation in electroplating and surface treatment processes for semiconductor applications. Your work will directly impact product quality, efficiency, and scalability in a fast-paced, technology-driven environment. Based in Denpasar or Badung, you’ll collaborate with cross-functional teams to optimize plating workflows, troubleshoot process deviations, and implement cutting-edge solutions.
Why Bali? Beyond the professional rewards, this role lets you thrive in one of the world’s most sought-after destinations—where modern infrastructure meets tropical serenity. Enjoy a Monday-to-Friday workweek with time to explore Bali’s culture, beaches, and vibrant expat community.
Responsibility
- Develop, optimize, and maintain electroplating and surface finishing processes for semiconductor components to meet stringent quality and yield targets.
- Conduct DOE (Design of Experiments) and statistical analysis to improve process stability, efficiency, and cost-effectiveness.
- Collaborate with R&D and production teams to scale up new plating technologies from pilot to mass production.
- Monitor and troubleshoot process deviations, implementing corrective actions to minimize downtime and defects.
- Ensure compliance with industry standards (ISO, IPC, SEMATECH) and internal quality control protocols.
- Train and mentor junior engineers and technicians on plating equipment operation, safety, and best practices.
- Lead continuous improvement initiatives (e.g., Lean, Six Sigma) to enhance productivity and reduce waste.
- Document and report process performance metrics, including CPK, yield rates, and defect analysis.
Qualifications
- Bachelor’s or Master’s degree in Chemical Engineering, Materials Science, or related fields.
- Minimum 5 years of hands-on experience in semiconductor plating (e.g., copper, gold, nickel, or tin plating).
- Proficient in process characterization tools (e.g., SEM, XRD, AFM, profilometry) and SPC (Statistical Process Control).
- Strong knowledge of electrochemistry, corrosion control, and surface treatment principles.
- Experience with plating equipment (e.g., fume hoods, rectifiers, automated lines) and troubleshooting.
- Familiarity with cleanroom protocols, ESD control, and semiconductor manufacturing standards.
- Excellent problem-solving, analytical, and project management skills.
- Fluency in English; ability to work in a multicultural team environment.