job description
Join a cutting-edge semiconductor packaging facility in Bali as a Senior Manufacturing Automation (MA) Engineer, where you’ll lead critical failure analysis, optimize testing equipment, and drive continuous quality improvements. This role is pivotal in ensuring the reliability and performance of advanced semiconductor products through data-driven root cause investigations and process enhancements.
As part of a dynamic engineering team, you’ll collaborate with cross-functional stakeholders to troubleshoot complex manufacturing challenges, implement automation solutions, and uphold the highest standards of product excellence. Your expertise will directly impact operational efficiency, yield rates, and customer satisfaction in a high-tech industry.
This is a unique opportunity to leverage your technical leadership in a fast-paced, innovative environment while contributing to the growth of semiconductor manufacturing in Southeast Asia.
Responsibility
- Lead failure analysis for semiconductor packaging products, identifying defects and proposing corrective actions.
- Manage, calibrate, and optimize testing equipment to ensure accuracy, efficiency, and compliance with industry standards.
- Drive root cause investigations using statistical tools (e.g., 8D, DMAIC, Fishbone) and implement sustainable solutions.
- Develop and enhance automation scripts and control systems to streamline manufacturing processes.
- Collaborate with R&D, production, and quality teams to improve yield rates and reduce scrap.
- Monitor process performance metrics (CPK, OEE, FTT) and recommend data-driven improvements.
- Train and mentor junior engineers and technicians on best practices in semiconductor testing and troubleshooting.
- Stay abreast of emerging trends in semiconductor packaging and automation technologies.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
- Minimum 5 years of experience in semiconductor manufacturing, packaging, or failure analysis.
- Proven expertise in testing equipment (e.g., ATE, probe stations, X-ray, SEM) and automation tools (Python, LabVIEW, PLC).
- Strong analytical skills with proficiency in statistical process control (SPC) and root cause analysis methodologies.
- Experience with ISO 9001, IATF 16949, or other quality management systems.
- Excellent problem-solving abilities and attention to detail in high-precision environments.
- Familiarity with semiconductor packaging processes (e.g., wire bonding, die attach, encapsulation).
- Strong communication skills in English; ability to document findings and present technical reports.