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Engineering 🏢 Full Time ⭐️ Terverifikasi

Semiconductor Process Engineer - Back-End Assembly

Renesas Electronics
Badung, Bali
Salary Estimate
Rp 15.000.000 – Rp 25.000.000
Newest
Live Update
13 Juli 2026
Deadline
13 Jul 2027

job description

Join Renesas Electronics, a global leader in semiconductor solutions, as a Process Engineer specializing in back-end assembly. This is a unique opportunity to contribute to cutting-edge semiconductor manufacturing in the vibrant tech hub of Bali.

In this role, you will play a pivotal part in optimizing and enhancing semiconductor assembly processes, ensuring top-tier quality and efficiency. Your expertise will directly impact the production of advanced electronic components that power innovations across industries.

We offer a competitive salary, a collaborative work environment, and the chance to work with industry-leading technology. If you are passionate about semiconductor engineering and eager to advance your career with a renowned global company, we invite you to apply.

Responsibility

  • Develop, optimize, and maintain semiconductor back-end assembly processes, including die attach, wire bonding, and encapsulation.
  • Monitor and analyze process performance metrics to identify areas for improvement and implement corrective actions.
  • Collaborate with cross-functional teams, including R&D, quality assurance, and production, to ensure seamless process integration.
  • Troubleshoot and resolve technical issues related to assembly processes to minimize downtime and maximize yield.
  • Conduct root cause analysis (RCA) for process deviations and implement preventive measures.
  • Document and maintain standard operating procedures (SOPs) and work instructions for assembly processes.
  • Support new product introductions (NPI) by developing and validating assembly processes for prototype and mass production.
  • Stay updated with industry trends and emerging technologies in semiconductor back-end assembly.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
  • Minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die attach, wire bonding, or encapsulation.
  • Strong understanding of semiconductor manufacturing principles and process control techniques.
  • Experience with statistical process control (SPC), Design of Experiments (DOE), and failure mode analysis.
  • Proficiency in using metrology and inspection tools (e.g., SEM, X-ray, optical microscopy).
  • Excellent problem-solving and analytical skills with a data-driven approach.
  • Strong communication and teamwork abilities to collaborate effectively across departments.
  • Familiarity with ISO/TS 16949, ISO 9001, or other quality management systems is a plus.

Required Skills

Semiconductor Manufacturing Back-End Assembly Die Attach Wire Bonding Encapsulation Process Optimization SPC DOE Root Cause Analysis Metrology Quality Control ISO 16949 ISO 9001

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