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Engineering 🏢 Full Time ⭐️ Terverifikasi

Semiconductor Process Assistant Engineer / Engineering Technician (Advanced Packaging & R&D)

Corestaff Pte Ltd
Bali, Indonesia
Salary Estimate
Rp 12.000.000 – Rp 20.000.000
Newest
Live Update
18 Juli 2026
Deadline
18 Jul 2027

job description

Join Corestaff Pte Ltd, a leading name in semiconductor innovation, as a Semiconductor Process Assistant Engineer / Engineering Technician in the heart of Bali, Indonesia. This is a hands-on, dynamic role that offers unparalleled exposure to advanced packaging technologies and next-generation semiconductor R&D. If you're passionate about cutting-edge technology and eager to contribute to groundbreaking projects, this is your opportunity to work with a global team while enjoying the vibrant culture and lifestyle of Bali.

In this role, you will collaborate with senior engineers and researchers to develop, test, and optimize semiconductor processes. You’ll gain experience with state-of-the-art equipment and methodologies, making this an ideal position for those looking to advance their career in semiconductor engineering. Whether you're based in Canggu, Ubud, Denpasar, Jimbaran, Nusa Dua, Kuta, or Badung, this role offers flexibility and the chance to work in a fast-paced, innovative environment.

At Corestaff, we value creativity, problem-solving, and a strong work ethic. You’ll be part of a team that drives technological advancements while fostering a collaborative and inclusive workplace. This is more than just a job—it’s a chance to shape the future of semiconductor technology while enjoying the unique lifestyle that Bali has to offer.

If you’re ready to take the next step in your engineering career and work on projects that matter, apply today and become a key player in our mission to push the boundaries of semiconductor innovation.

Responsibility

  • Assist in the development, testing, and optimization of semiconductor processes, including advanced packaging techniques.
  • Operate and maintain semiconductor fabrication equipment, ensuring adherence to safety and quality standards.
  • Collaborate with senior engineers to troubleshoot process issues and implement improvements.
  • Conduct experiments and analyze data to support R&D initiatives in next-generation semiconductor technologies.
  • Document process parameters, test results, and technical reports for internal and external stakeholders.
  • Support the design and execution of pilot production runs for new semiconductor products.
  • Ensure compliance with industry standards and best practices in semiconductor manufacturing.
  • Participate in cross-functional team meetings to align on project goals and timelines.

Qualifications

  • Diploma or Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, or a related field.
  • 1-3 years of hands-on experience in semiconductor processing, packaging, or R&D (internships or academic projects may be considered).
  • Familiarity with semiconductor fabrication tools and techniques, such as lithography, etching, or deposition.
  • Strong analytical and problem-solving skills, with the ability to interpret technical data and troubleshoot process issues.
  • Basic understanding of semiconductor physics, materials science, or microelectronics.
  • Proficiency in using lab equipment and software for data analysis (e.g., MATLAB, LabVIEW, or Python).
  • Excellent communication skills, with the ability to work effectively in a team environment.
  • Willingness to learn and adapt to new technologies and methodologies in a fast-paced R&D setting.

Required Skills

semiconductor processing advanced packaging R&D lithography etching deposition data analysis MATLAB LabVIEW Python technical documentation troubleshooting team collaboration

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