job description
Join STMicroelectronics, a global leader in semiconductor solutions, as a Product Quality & Reliability Engineer in our dynamic team based in Bali, Indonesia. This role is ideal for a seasoned OSAT (Outsourced Semiconductor Assembly and Test) specialist with a passion for driving excellence in semiconductor manufacturing, process optimization, and backend support.
In this position, you will play a pivotal role in ensuring the highest standards of product quality and reliability through advanced statistical analysis, Design of Experiments (DOE), and root-cause problem-solving. Your expertise will directly contribute to enhancing assembly/test processes, reducing defects, and improving yield for cutting-edge semiconductor products.
If you thrive in a fast-paced, innovation-driven environment and have a proven track record in semiconductor quality engineering, we invite you to apply and help shape the future of technology with STMicroelectronics.
Responsibility
- Lead quality and reliability initiatives for semiconductor assembly and test processes, ensuring compliance with industry standards (e.g., JEDEC, AEC-Q).
- Design and execute DOE (Design of Experiments) to optimize process parameters, improve yield, and reduce variability.
- Conduct statistical analysis (e.g., SPC, Six Sigma) to identify trends, root causes of failures, and implement corrective actions.
- Collaborate with cross-functional teams (R&D, Manufacturing, Supply Chain) to resolve complex technical issues in backend operations.
- Develop and maintain quality control protocols, including inspection criteria, test methodologies, and failure analysis procedures.
- Support new product introductions (NPI) by validating assembly/test processes and ensuring reliability targets are met.
- Drive continuous improvement projects to enhance efficiency, reduce costs, and minimize defects in semiconductor packaging.
- Prepare technical reports, presentations, and documentation for internal stakeholders and customers.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Industrial Engineering, or a related field.
- Minimum 5+ years of experience in semiconductor OSAT, assembly/test engineering, or backend operations.
- Proven expertise in process optimization, DOE, and statistical analysis (e.g., Minitab, JMP, Python/R).
- Strong knowledge of semiconductor packaging technologies (e.g., wire bonding, flip-chip, WLCSP) and reliability testing (e.g., HTOL, THB, temperature cycling).
- Experience with failure analysis tools (e.g., SEM, EDX, CSAM) and root-cause investigation methodologies.
- Familiarity with quality management systems (e.g., ISO 9001, IATF 16949) and industry standards (e.g., JEDEC, AEC-Q100).
- Excellent problem-solving, analytical, and communication skills with the ability to work in a global team.
- Proficiency in English (written and verbal); additional languages are a plus.