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Engineering 🏢 Internship ⭐️ Terverifikasi

Product Integration Engineer (PIE) Intern - AI & 3D-NAND Innovation

Micron Semiconductors
Badung, Bali, Indonesia
Salary Estimate
Rp 8.000.000 – Rp 12.000.000
Newest
Live Update
2 Agustus 2026
Deadline
2 Agu 2027

job description

Join Micron Semiconductors as a Product Integration Engineer (PIE) Intern and be at the forefront of AI-powered 3D-NAND innovation in Bali! This is a unique opportunity to contribute to cutting-edge semiconductor solutions that drive efficiency, performance, and scalability in next-gen memory technologies.

As part of our dynamic team, you’ll collaborate with cross-functional experts to integrate, test, and optimize 3D-NAND flash memory products, leveraging AI-driven analytics to enhance yield, reliability, and speed. Your work will directly impact the development of high-performance storage solutions for global markets.

Based in the vibrant tech hub of Badung, Bali, you’ll enjoy a collaborative work environment, mentorship from industry leaders, and exposure to real-world challenges in semiconductor engineering. Whether you’re passionate about AI, data analysis, or hardware integration, this internship will equip you with the skills to thrive in the fast-evolving tech landscape.

Responsibility

  • Assist in the integration and validation of 3D-NAND memory products using AI-based tools and methodologies.
  • Support data analysis and yield enhancement initiatives to improve product performance and reliability.
  • Collaborate with R&D and manufacturing teams to troubleshoot integration issues and propose solutions.
  • Develop and execute test scripts and automation for semiconductor validation processes.
  • Contribute to documentation and reporting of integration workflows, test results, and performance metrics.
  • Participate in cross-functional meetings to align on project goals and timelines.
  • Stay updated on emerging trends in AI, machine learning, and memory technologies to drive innovation.
  • Assist in prototyping and benchmarking new integration techniques for next-gen products.

Qualifications

  • Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
  • Strong foundation in semiconductor physics, memory technologies, or AI/ML applications.
  • Familiarity with Python, C/C++, or data analysis tools (e.g., Pandas, NumPy, TensorFlow).
  • Basic understanding of hardware testing, validation, or automation frameworks.
  • Excellent problem-solving and analytical skills with a detail-oriented mindset.
  • Ability to work in a fast-paced, team-driven environment with minimal supervision.
  • Strong communication and documentation skills in English.
  • Passion for innovation in semiconductor and AI technologies is a plus.

Required Skills

AI Machine Learning 3D-NAND Semiconductor Engineering Python C/C++ Data Analysis Hardware Testing Automation Problem-Solving Team Collaboration

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