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Engineering 🏢 Internship ⭐️ Terverifikasi

Process Engineering Intern - Semiconductor Manufacturing

Renesas Electronics
Bayan Lepas, Penang
Salary Estimate
MYR 1.700 – MYR 1.700
Newest
Live Update
11 Agustus 2026
Deadline
11 Agu 2027

job description

Kickstart your engineering career with Renesas Electronics, a global leader in semiconductor solutions. As a Process Engineering Intern, you’ll gain hands-on experience in cutting-edge Die Attach and Wire Bond processes, contributing to real-world projects that drive innovation in microelectronics.

This internship offers a unique opportunity to work alongside industry experts, analyze critical production data, and propose process improvements that enhance efficiency, quality, and yield. You’ll develop technical skills in semiconductor manufacturing while building a foundation for a successful career in engineering.

Based in our state-of-the-art facility in Bayan Lepas, Penang, this role is perfect for ambitious students or recent graduates eager to apply theoretical knowledge in a dynamic, high-tech environment. Join us and be part of the technology that powers the future!

Responsibility

  • Assist in the execution and monitoring of Die Attach and Wire Bond processes in a semiconductor manufacturing environment.
  • Collect, analyze, and interpret production data to identify trends, anomalies, and areas for improvement.
  • Support process optimization projects by conducting experiments, documenting results, and proposing solutions.
  • Collaborate with cross-functional teams (e.g., Quality Assurance, Production) to troubleshoot process-related issues.
  • Prepare technical reports, presentations, and process documentation for internal stakeholders.
  • Assist in the calibration and maintenance of process equipment under supervision.
  • Participate in continuous improvement initiatives (e.g., Lean, Six Sigma) to enhance operational efficiency.
  • Adhere to safety, quality, and compliance standards in all operational activities.

Qualifications

  • Currently pursuing or recently completed a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
  • Basic understanding of semiconductor manufacturing processes (Die Attach, Wire Bond, or similar) is a plus.
  • Proficiency in data analysis tools (e.g., Excel, Python, Minitab) and statistical methods.
  • Strong problem-solving skills with a detail-oriented and analytical mindset.
  • Excellent written and verbal communication skills in English.
  • Ability to work independently and collaboratively in a fast-paced environment.
  • Familiarity with ISO/TS standards, SPC (Statistical Process Control), or DOE (Design of Experiments) is advantageous.
  • Prior internship or project experience in a manufacturing or R&D setting is a bonus.

Required Skills

Semiconductor Manufacturing Die Attach Wire Bond Process Engineering Data Analysis Statistical Process Control (SPC) Lean Manufacturing Six Sigma Python Excel Technical Documentation Problem Solving Quality Assurance

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