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Manufacturing 🏢 Full Time ⭐️ Terverifikasi

Manufacturing Technician - Semiconductor Operations

onsemi
Canggu, Bali
Salary Estimate
Rp 8.000.000 – Rp 12.000.000
Newest
Live Update
17 Juli 2026
Deadline
17 Jul 2027

job description

Join onsemi, a global leader in semiconductor solutions, as a Manufacturing Technician in our cutting-edge facility in Bali. This is a unique opportunity to contribute to the production of advanced semiconductor components while working in a dynamic, innovative environment. You will play a crucial role in ensuring the smooth operation of our manufacturing processes, including Die Bond/Clip Bonding and Wire Bonding, while maintaining the highest standards of quality and efficiency.

As part of our team, you will work with state-of-the-art equipment and collaborate with industry experts to drive technological advancements. This role offers competitive compensation, comprehensive benefits, and the chance to grow your career in the fast-paced world of semiconductor manufacturing.

Responsibility

  • Operate and maintain semiconductor manufacturing equipment, including Die Bond/Clip Bonding and Wire Bonding machines.
  • Perform routine inspections and preventive maintenance to ensure equipment reliability and performance.
  • Monitor production processes to identify and resolve issues, ensuring adherence to quality standards.
  • Collaborate with engineering and quality assurance teams to implement process improvements.
  • Document production data, equipment performance, and maintenance activities accurately.
  • Follow safety protocols and maintain a clean, organized work environment.
  • Troubleshoot technical issues and perform minor repairs as needed.
  • Participate in training programs to stay updated on new technologies and best practices.

Qualifications

  • Diploma or vocational training in Electrical, Mechanical, or Electronics Engineering.
  • Minimum of 2 years of experience in semiconductor manufacturing or a related field.
  • Familiarity with Die Bond/Clip Bonding and Wire Bonding processes is a plus.
  • Strong technical aptitude and problem-solving skills.
  • Ability to read and interpret technical drawings and manuals.
  • Excellent attention to detail and commitment to quality.
  • Good communication skills and ability to work in a team environment.
  • Willingness to work in shifts and adapt to changing priorities.

Required Skills

semiconductor manufacturing die bond clip bonding wire bonding equipment maintenance quality control troubleshooting technical documentation

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