job description
Join Carsem, a global leader in semiconductor packaging and test solutions, as a Front-Of-Line (FOL) Power Packaging Staff Engineer in the vibrant heart of Bali, Indonesia. This is a unique opportunity to drive innovation in advanced semiconductor packaging technologies while enjoying the tropical paradise of Bali.
In this pivotal role, you will lead the development and execution of cutting-edge Front-of-Line (FOL) semiconductor packaging processes, ensuring high-performance, reliability, and scalability for power devices. Your expertise will directly contribute to advancing Carsemâs position as a pioneer in the semiconductor industry, working on next-generation solutions for automotive, industrial, and consumer electronics applications.
Based in Denpasar, youâll collaborate with a dynamic, international team of engineers and researchers, leveraging state-of-the-art facilities to push the boundaries of packaging technology. Whether you're optimizing process flows, troubleshooting complex technical challenges, or mentoring junior engineers, your work will have a tangible impact on the future of electronics.
If you are a passionate engineer with a track record in semiconductor packaging and a desire to work in a fast-paced, innovative environment, we invite you to apply and be part of a company that values excellence, creativity, and continuous improvement.
Responsibility
- Lead the design, development, and optimization of Front-of-Line (FOL) semiconductor packaging processes for power devices, ensuring alignment with industry standards and customer requirements.
- Collaborate with cross-functional teams (R&D, Process Engineering, Quality Assurance) to develop and implement new packaging solutions that enhance performance, reliability, and cost-efficiency.
- Conduct feasibility studies, DOE (Design of Experiments), and process characterization to validate new materials, equipment, and methodologies.
- Drive continuous improvement initiatives by analyzing process data, identifying bottlenecks, and implementing corrective actions to enhance yield and efficiency.
- Provide technical leadership and mentorship to junior engineers and technicians, fostering a culture of innovation and knowledge-sharing.
- Work closely with customers and suppliers to understand technical requirements, resolve packaging-related challenges, and ensure seamless project execution.
- Develop and maintain comprehensive documentation, including process specifications, work instructions, and technical reports, to ensure compliance with ISO/TS and other relevant standards.
- Stay abreast of emerging trends and technologies in semiconductor packaging, particularly in power devices, and propose strategic initiatives to maintain Carsemâs competitive edge.
Qualifications
- Bachelorâs or Masterâs degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field. A PhD is a plus.
- Minimum 8+ years of experience in semiconductor packaging, with a focus on Front-of-Line (FOL) processes such as die attach, wire bonding, or flip-chip technologies.
- Proven expertise in power device packaging (e.g., IGBT, MOSFET, SiC, GaN) and familiarity with high-reliability applications (automotive, industrial).
- Strong background in process development, DOE, and statistical analysis (e.g., JMP, Minitab) to drive data-driven decision-making.
- Experience with semiconductor packaging equipment (e.g., die bonder, wire bonder, mold press) and process characterization tools (SEM, X-ray, CSAM).
- Excellent problem-solving and project management skills, with the ability to lead multiple initiatives in a fast-paced environment.
- Familiarity with quality management systems (ISO 9001, IATF 16949) and reliability testing standards (AEC-Q100, JEDEC).
- Strong communication and interpersonal skills, with the ability to collaborate effectively with global teams and stakeholders.