Beranda Job Details
C
Engineering 🏢 Full Time ⭐️ Terverifikasi

FOL Process Engineer

Coherent
Canggu, Ubud, Denpasar, Jimbaran, Nusa Dua, Kuta, Badung
Salary Estimate
Rp 15.000.000 – Rp 25.000.000
Newest
Live Update
18 Juli 2026
Deadline
18 Jul 2027

job description

Join Coherent as a FOL Process Engineer and play a pivotal role in sustaining and enhancing our Die Attach & Wire Bond processes. This is a unique opportunity to contribute to cutting-edge electronics manufacturing in a dynamic and innovative environment. You will be responsible for optimizing processes, ensuring quality, and driving continuous improvement initiatives.

Based in the vibrant regions of Bali, this role offers a blend of professional growth and an exceptional lifestyle. If you are passionate about engineering excellence and eager to make a significant impact, we invite you to apply and become part of our global team.

Responsibility

  • Sustain and improve Die Attach & Wire Bond processes to enhance efficiency and quality.
  • Develop and implement process improvements to reduce defects and increase yield.
  • Collaborate with cross-functional teams to ensure seamless integration of processes.
  • Conduct root cause analysis and implement corrective actions for process deviations.
  • Monitor and analyze process performance metrics to identify areas for optimization.
  • Provide technical support and training to production teams.
  • Ensure compliance with industry standards and company policies.
  • Participate in the development and validation of new processes and technologies.

Qualifications

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field.
  • Proven experience in electronics manufacturing, particularly in Die Attach & Wire Bond processes.
  • Strong knowledge of process engineering principles and methodologies.
  • Experience with statistical process control (SPC) and data analysis tools.
  • Excellent problem-solving and analytical skills.
  • Ability to work effectively in a team-oriented environment.
  • Strong communication and interpersonal skills.
  • Familiarity with industry standards and regulations.

Required Skills

Process Engineering Die Attach Wire Bond Electronics Manufacturing SPC Data Analysis Problem Solving Team Collaboration

Ready to Take This Challenge?

Make sure your resume is ready. Submit your application now before the deadline..

Apply Now

Lowongan Terkait

Rekomendasi pekerjaan serupa untuk Anda

Lihat Semua