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Engineering 🏢 Full Time ⭐️ Terverifikasi

Field Application Engineer (AOI/SPI/AXI) - SMT Inspection Systems

Test Research Innovation Malaysia
Bali, Indonesia
Salary Estimate
Rp 25.000.000 – Rp 40.000.000
Newest
Live Update
4 Juli 2026
Deadline
4 Jul 2027

job description

Join Test Research Innovation Malaysia as a Field Application Engineer (AOI/SPI/AXI) and play a pivotal role in advancing SMT (Surface Mount Technology) inspection systems. This position offers a unique opportunity to provide expert technical support, troubleshoot complex issues, and drive customer success in the electronics manufacturing industry.

As a Field Application Engineer, you will collaborate with global teams to deliver cutting-edge solutions for Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Automated X-Ray Inspection (AXI) systems. Your expertise will ensure seamless integration, optimization, and performance of our inspection technologies, empowering clients to achieve operational excellence.

Based in Bali, Indonesia, this role combines technical depth with customer-facing engagement, making it ideal for professionals passionate about innovation and problem-solving in a dynamic, high-tech environment.

Responsibility

  • Provide on-site and remote technical support for AOI, SPI, and AXI inspection systems to global clients.
  • Troubleshoot hardware and software issues, ensuring minimal downtime and optimal system performance.
  • Conduct training sessions for customers on system operation, maintenance, and best practices.
  • Collaborate with R&D and engineering teams to gather feedback and drive product improvements.
  • Develop and implement customized solutions to meet specific customer requirements.
  • Perform system installations, upgrades, and calibration to ensure precision and reliability.
  • Generate detailed technical reports and documentation for internal and external stakeholders.
  • Stay updated with industry trends and emerging technologies in SMT inspection systems.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Electronics, Mechanical Engineering, or a related field.
  • Minimum 3 years of experience in field application engineering, preferably in AOI/SPI/AXI or SMT inspection systems.
  • Strong knowledge of PCB assembly processes, soldering technologies, and defect analysis.
  • Hands-on experience with inspection equipment, machine vision, or X-ray systems is a plus.
  • Excellent problem-solving skills and ability to work under pressure in fast-paced environments.
  • Proficient in English (written and verbal) with strong communication and interpersonal skills.
  • Willingness to travel domestically and internationally as required.
  • Familiarity with IPC standards, ISO 9001, or other quality management systems is advantageous.

Required Skills

AOI SPI AXI SMT PCB Inspection Machine Vision X-Ray Inspection Technical Support Troubleshooting Electronics Manufacturing Field Service Customer Training Hardware/Software Debugging IPC Standards

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