job description
Join Accion Labs as a FCA Process Engineer (Flip Chip Attach Engineer) in beautiful Bali! This is a unique opportunity to work with cutting-edge semiconductor technology while enjoying the vibrant culture and lifestyle of Bali. As a key member of our engineering team, you will be responsible for optimizing and maintaining the Flip Chip Attach (FCA) process, ensuring high-quality production and continuous improvement in our manufacturing operations.
At Accion Labs, we are committed to innovation and excellence. We offer a collaborative work environment, competitive compensation, and the chance to grow your career in a dynamic industry. If you are passionate about semiconductor engineering and eager to make an impact, we want to hear from you!
Responsibility
- Develop, optimize, and maintain the Flip Chip Attach (FCA) process to ensure high yield and quality.
- Collaborate with cross-functional teams to troubleshoot and resolve process-related issues.
- Conduct process characterization and qualification to meet product specifications.
- Implement continuous improvement initiatives to enhance process efficiency and reliability.
- Monitor and analyze process data to identify trends and areas for improvement.
- Provide technical support and training to production and engineering teams.
- Ensure compliance with industry standards and company policies.
- Participate in the development and validation of new processes and technologies.
Qualifications
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related field.
- Minimum of 3 years of experience in semiconductor manufacturing, with a focus on Flip Chip Attach processes.
- Strong understanding of semiconductor packaging technologies and processes.
- Experience with process optimization, troubleshooting, and data analysis.
- Familiarity with statistical process control (SPC) and design of experiments (DOE).
- Excellent problem-solving and communication skills.
- Ability to work effectively in a team environment.
- Knowledge of industry standards and best practices.