job description
Join Carsem, a global leader in semiconductor assembly and testing, as a Die Attach & Wire Bond Process Engineer in beautiful Bali, Indonesia. This is your opportunity to drive innovation in microelectronics while contributing to cutting-edge solutions that power next-generation technologies.
In this pivotal role, you will optimize and maintain die attach and wire bonding processes to ensure maximum yield, reliability, and performance of semiconductor devices. You’ll collaborate with cross-functional teams to troubleshoot process issues, implement continuous improvements, and support new product introductions (NPI). Your expertise will directly impact the efficiency and quality of our manufacturing operations.
Bali offers a unique blend of professional growth and work-life balance, with its vibrant culture, modern infrastructure, and proximity to global tech hubs. Whether you're advancing your career or seeking a dynamic environment, this role provides the perfect platform to excel in the semiconductor industry.
Responsibility
- Develop, optimize, and sustain die attach and wire bonding processes to meet yield, reliability, and performance targets.
- Conduct DOE (Design of Experiments) and statistical analysis to improve process stability and efficiency.
- Troubleshoot and resolve process-related issues, implementing corrective actions to minimize downtime.
- Collaborate with R&D, quality, and production teams to support new product introductions (NPI) and process transfers.
- Monitor and maintain process control parameters, ensuring compliance with industry standards (e.g., JEDEC, MIL-STD).
- Lead continuous improvement initiatives, including cost reduction and cycle time optimization.
- Train and mentor technicians and junior engineers on best practices in semiconductor assembly.
- Document and maintain process specifications, work instructions, and technical reports.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- Minimum 3+ years of hands-on experience in die attach and/or wire bonding processes in semiconductor manufacturing.
- Strong knowledge of process characterization, DOE, SPC, and root cause analysis tools (e.g., 8D, Fishbone).
- Experience with gold/aluminum wire bonding, eutectic/epoxy die attach, and related equipment (e.g., Kulicke & Soffa, Besi, ASM).
- Familiarity with failure analysis techniques (e.g., CSAM, X-ray, pull/shear testing).
- Proficient in data analysis tools (e.g., JMP, Minitab, Excel) and process simulation software.
- Excellent problem-solving skills and ability to work in a fast-paced, high-precision environment.
- Strong communication skills in English; ability to collaborate across multicultural teams.