job description
Join Texas Instruments in our Career Accelerator Program (CAP) as a Packaging Engineer and kickstart your career in a dynamic, innovation-driven environment. This program is designed to empower recent graduates and early-career professionals with hands-on experience, mentorship, and cutting-edge projects in semiconductor packaging.
At TI, we believe in changing the world through technology. As part of this program, you’ll collaborate with industry experts to develop advanced packaging solutions that enhance performance, reliability, and efficiency in electronic devices. Whether you’re optimizing thermal management, improving miniaturization, or pioneering sustainable materials, your work will have a tangible impact on global technology.
Based in Bali, Indonesia, this role offers a unique blend of professional growth and work-life balance in one of the world’s most inspiring locations. TI is committed to fostering diversity, inclusion, and continuous learning—giving you the tools to thrive in a fast-paced, supportive culture.
Responsibility
- Design, develop, and test semiconductor packaging solutions to meet performance, cost, and reliability targets.
- Collaborate with cross-functional teams (R&D, manufacturing, quality assurance) to optimize packaging processes.
- Conduct failure analysis and implement corrective actions to enhance product durability.
- Utilize CAD tools and simulation software to model and validate packaging designs.
- Support prototype development and transition to high-volume manufacturing.
- Stay abreast of industry trends in materials, thermal management, and miniaturization.
- Document technical specifications, test reports, and process improvements.
- Participate in CAP training modules, workshops, and mentorship sessions.
Qualifications
- Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related fields.
- 0–2 years of experience in semiconductor packaging, microelectronics, or related industries (internships count!).
- Strong foundation in thermal mechanics, material properties, and manufacturing processes.
- Proficiency in CAD tools (e.g., AutoCAD, SolidWorks) or simulation software (e.g., ANSYS, COMSOL).
- Analytical mindset with problem-solving skills and attention to detail.
- Excellent communication and teamwork abilities in a multicultural environment.
- Familiarity with IPC standards, JEDEC specifications, or DFM (Design for Manufacturing) is a plus.
- Passion for innovation and a drive to contribute to next-gen technology.