job description
Are you ready to join a global leader in wide bandgap semiconductor technology? Wolfspeed Malaysia is seeking a highly skilled Assembly Manufacturing Engineer to join our expanding team in Ipoh. In this role, you will play a critical part in optimizing our backend assembly processes, ensuring the highest standards of quality, efficiency, and yield for our next-generation semiconductor products.
As an Assembly Manufacturing Engineer, you will bridge the gap between process development and high-volume production. You will be responsible for overseeing sophisticated inspection and sorting workflows, including die picking and testing operations. Your technical expertise will be vital in identifying process bottlenecks, implementing continuous improvement projects, and driving operational excellence within our manufacturing facility. If you are passionate about semiconductor innovation and thrive in a fast-paced environment, we invite you to advance your career with a pioneer in power electronics.
Responsibility
- Lead process optimization projects to enhance assembly yield, throughput, and cycle time for semiconductor backend operations.
- Manage complex inspection and sorting equipment, ensuring high-precision die picking and accurate testing.
- Analyze manufacturing data to troubleshoot process deviations and implement robust corrective and preventive actions (CAPA).
- Collaborate with cross-functional teams, including R&D and Quality Engineering, to support new product introductions (NPI) and process scaling.
- Standardize operational procedures (SOPs) for assembly lines to ensure consistency and compliance with global manufacturing standards.
- Coordinate with maintenance teams to ensure high equipment availability and performance for critical dicing and inspection tools.
- Provide technical guidance and training to manufacturing technicians to maintain a culture of quality and safety.
Qualifications
- Bachelor’s degree in Electrical, Electronics, Mechanical, or Manufacturing Engineering (or a related technical field).
- Minimum 3-5 years of direct experience in semiconductor assembly, specifically in dicing, inspection, and die picking processes.
- Strong background in backend manufacturing flows and testing methodologies.
- Proven track record in project management, including the ability to manage timelines and cross-departmental stakeholders.
- Proficiency in statistical process control (SPC) and data analysis tools (e.g., JMP, Minitab) for process monitoring.
- Strong problem-solving skills with a logical, analytical approach to complex manufacturing challenges.
- Excellent communication skills with the ability to work effectively in a multicultural, fast-paced industrial environment.