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Engineering 🏢 Full Time ⭐️ Terverifikasi

Service and Application Engineer - Advanced Semiconductor Equipment (Bali, Indonesia)

Zen Voce
Bali, Indonesia
Salary Estimate
Rp 12.000.000 – Rp 20.000.000
Newest
Live Update
7 Agustus 2026
Deadline
7 Agu 2027

job description

Join Zen Voce, a leading innovator in semiconductor manufacturing solutions, as our Service and Application Engineer in the vibrant tech hub of Bali, Indonesia. In this critical role, you'll be the technical backbone for our advanced LED Wafer/Die Probing, BIB Handler, Oven, Wire Bonding, Ball Mount, Dicing, and robotic systems. Your expertise will drive operational excellence, ensuring our clients in the semiconductor industry achieve peak performance and reliability.

As part of our dynamic team, you'll collaborate with cross-functional groups to provide unparalleled service and application support, troubleshoot complex technical challenges, and deliver tailored solutions that enhance productivity. This is a unique opportunity to work with cutting-edge technology in a fast-paced environment while enjoying the unparalleled lifestyle that Bali offers.

If you're a problem-solver with a passion for semiconductor equipment and a desire to grow your career in a forward-thinking company, we want to hear from you. Zen Voce offers a competitive salary, professional development opportunities, and a supportive work culture that values innovation and collaboration.

Responsibility

  • Provide expert technical support and troubleshooting for semiconductor equipment, including LED Wafer/Die Probing, BIB Handlers, Ovens, Wire Bonding, Ball Mount, Dicing, and robotic systems.
  • Install, configure, and optimize equipment to ensure maximum performance and reliability for clients in the semiconductor industry.
  • Collaborate with engineering and R&D teams to develop and implement application-specific solutions tailored to client needs.
  • Conduct on-site and remote service visits to diagnose issues, perform repairs, and provide preventive maintenance.
  • Train and mentor clients on equipment operation, best practices, and safety protocols to enhance their technical capabilities.
  • Document service reports, technical findings, and solutions to maintain a knowledge base for future reference.
  • Participate in continuous improvement initiatives to enhance equipment performance, reduce downtime, and drive innovation.
  • Stay updated on industry trends, emerging technologies, and advancements in semiconductor manufacturing to provide cutting-edge solutions.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Mechatronics, or a related field.
  • Minimum of 3 years of experience in service, application support, or field engineering for semiconductor equipment.
  • Hands-on experience with LED Wafer/Die Probing, BIB Handlers, Wire Bonding, or similar semiconductor manufacturing tools.
  • Strong troubleshooting skills and the ability to diagnose complex technical issues in a timely manner.
  • Proficiency in reading and interpreting technical schematics, manuals, and engineering drawings.
  • Excellent communication skills in English, with the ability to convey technical concepts to non-technical stakeholders.
  • Willingness to travel domestically and internationally for on-site service and support as needed.
  • Certifications in semiconductor equipment (e.g., ASM, K&S, Besi) or related fields are a plus.

Required Skills

semiconductor equipment troubleshooting technical support equipment installation preventive maintenance wire bonding die probing robotic systems technical documentation client training

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