job description
Join Hewlett Packard Enterprise as a Senior Thermal/Hardware Engineer and lead the design, validation, and optimization of thermal solutions for cutting-edge, high-power networking systems. Based in the vibrant Badung region of Bali, youâll work at the intersection of hardware innovation and thermal management, ensuring our next-generation systems meet performance, reliability, and efficiency standards.
In this role, youâll leverage advanced Computational Fluid Dynamics (CFD) simulations, hands-on testing, and system-level architecture expertise to solve complex thermal challenges. Collaborate with cross-functional teams to deliver scalable, high-performance hardware solutions that power global enterprises. This is a unique opportunity to shape the future of networking infrastructure while enjoying Baliâs dynamic work-life balance.
HPE is committed to fostering a culture of innovation, diversity, and professional growth. If youâre passionate about thermal engineering and eager to make an impact in a global tech leader, weâd love to hear from you.
Responsibility
- Lead the thermal design and validation of high-power networking systems, from concept to production.
- Conduct CFD simulations (e.g., ANSYS Fluent, Icepak) to model airflow, heat transfer, and thermal performance.
- Develop and execute thermal testing protocols (wind tunnel, environmental chambers) to validate designs against specifications.
- Collaborate with mechanical, electrical, and systems engineering teams to integrate thermal solutions into hardware architectures.
- Optimize thermal management for power efficiency, acoustics, and reliability in data center and edge environments.
- Analyze field data and failure reports to identify thermal-related issues and drive corrective actions.
- Stay abreast of emerging thermal technologies (e.g., liquid cooling, heat pipes, advanced materials) and recommend innovations.
- Document technical findings and present recommendations to stakeholders and leadership.
Qualifications
- Bachelorâs or Masterâs degree in Mechanical Engineering, Thermal Engineering, or a related field.
- 5+ years of experience in thermal design for electronics/hardware, preferably in networking or data center systems.
- Proficiency in CFD tools (ANSYS, SolidWorks Flow Simulation) and thermal analysis software.
- Hands-on experience with thermal testing equipment (e.g., thermal cameras, anemometers, power analyzers).
- Strong understanding of heat transfer principles, fluid dynamics, and material properties.
- Familiarity with industry standards (e.g., ASHRAE, NEBS, IPC) for thermal management in hardware.
- Excellent problem-solving and communication skills to collaborate across global teams.
- Experience with high-power systems (e.g., servers, switches, GPUs) is a plus.