job description
Join SUHAY OPC, a leading innovator in semiconductor manufacturing, as our Senior Process Engineer (Backgrinding, Wafer Saw & Singulation) in the vibrant tech hub of Bali, Indonesia. We are seeking a results-driven engineering leader to optimize our backgrinding, wafer saw, and singulation processes, ensuring operational excellence, superior quality, and customer satisfaction. If you thrive in a dynamic, data-driven environment and are passionate about driving continuous improvement in semiconductor manufacturing, this is your opportunity to make a significant impact.
In this role, you will lead process optimization initiatives, troubleshoot complex technical challenges, and collaborate with cross-functional teams to enhance yield, efficiency, and product reliability. You will leverage your expertise in semiconductor process engineering to implement best practices, reduce defects, and drive cost-effective solutions. SUHAY OPC values innovation, teamwork, and a people-first approach, offering a collaborative work culture where your contributions are recognized and rewarded.
As part of our team, you will work in state-of-the-art facilities in Bali, a region known for its thriving tech ecosystem and high quality of life. We offer competitive compensation, professional development opportunities, and a supportive environment where you can grow your career while making a tangible difference in the semiconductor industry.
Responsibility
- Lead and optimize backgrinding, wafer saw, and singulation processes to improve yield, efficiency, and product quality.
- Develop and implement process improvements to reduce defects, cycle time, and operational costs.
- Collaborate with cross-functional teams, including R&D, production, and quality assurance, to ensure seamless process integration.
- Troubleshoot complex technical issues and provide data-driven solutions to enhance process stability and reliability.
- Monitor key performance indicators (KPIs) and generate reports to track process performance and identify areas for improvement.
- Ensure compliance with industry standards, safety protocols, and environmental regulations.
- Mentor junior engineers and technicians, fostering a culture of continuous learning and innovation.
- Drive customer-focused initiatives to meet and exceed client expectations for product quality and delivery.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
- Minimum of 5 years of experience in semiconductor process engineering, with a focus on backgrinding, wafer saw, or singulation processes.
- Proven track record of process optimization, yield improvement, and defect reduction in semiconductor manufacturing.
- Strong analytical and problem-solving skills, with proficiency in statistical process control (SPC), DOE, and root cause analysis (RCA).
- Experience with semiconductor manufacturing equipment (e.g., backgrinding machines, wafer saws, metrology tools).
- Familiarity with industry standards (e.g., SEMI, ISO) and safety protocols in semiconductor manufacturing.
- Excellent communication and leadership skills, with the ability to collaborate effectively with cross-functional teams.
- Self-motivated, detail-oriented, and committed to driving continuous improvement and operational excellence.