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Engineering 🏢 Full Time ⭐️ Terverifikasi

Senior Manager, HBM Customer Integration & System Engineering

Micron Semiconductors
Canggu, Ubud, Denpasar, Jimbaran, Nusa Dua, Kuta, Badung
Salary Estimate
USD 120.000 – USD 180.000
Newest
Live Update
15 Agustus 2026
Deadline
15 Agu 2027

job description

Join Micron Semiconductors, a global leader in innovative memory solutions, as a Senior Manager for HBM Customer Integration & System Engineering. In this pivotal role, you will drive customer-centric engineering solutions, ensuring seamless integration of high-bandwidth memory (HBM) technologies into cutting-edge systems. Based in the vibrant tech hubs of Bali, you'll collaborate with cross-functional teams to fuel the data economy and unlock new opportunities in semiconductor innovation.

As a key leader, you will bridge the gap between customer requirements and engineering execution, optimizing system performance and reliability. This role offers a unique chance to shape the future of memory solutions while enjoying the dynamic work-life balance of Bali’s thriving tech community.

Responsibility

  • Lead customer integration projects for HBM solutions, ensuring alignment with technical and business objectives.
  • Collaborate with engineering, product, and sales teams to deliver scalable and high-performance memory systems.
  • Drive system-level engineering strategies to enhance customer satisfaction and product adoption.
  • Oversee technical documentation, training, and support for HBM integration across global markets.
  • Identify and mitigate risks in system engineering processes to ensure seamless deployment.
  • Mentor junior engineers and foster a culture of innovation and continuous improvement.
  • Stay ahead of industry trends in semiconductor technology to inform product roadmaps.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
  • 10+ years of experience in semiconductor engineering, with a focus on memory solutions or system integration.
  • Proven leadership in managing cross-functional teams and customer-facing projects.
  • Strong understanding of HBM architecture, system design, and performance optimization.
  • Excellent communication skills to articulate complex technical concepts to stakeholders.
  • Experience with Agile methodologies and project management tools.
  • Ability to thrive in a fast-paced, collaborative environment.

Required Skills

HBM semiconductor engineering system integration customer engagement project management technical leadership

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