job description
Join STATS ChipPAC, a global leader in advanced semiconductor packaging and test solutions, as we expand our cutting-edge operations in Bali, Indonesia. We are seeking a dynamic Equipment Engineering Manager to oversee and optimize our Bumping, Middle-End-of-Line (MEOL), and Chip-on-Wafer (CoW) production lines. In this pivotal role, you will lead a team of engineers to ensure seamless equipment performance, utility infrastructure reliability, and continuous process improvements to meet the highest industry standards.
Based in the vibrant Badung region, you will drive operational excellence in a state-of-the-art facility, contributing to the development of next-generation semiconductor technologies. This is a unique opportunity to shape the future of microelectronics while enjoying the unparalleled work-life balance of Bali’s innovative tech hub.
If you are a results-driven leader with a passion for semiconductor manufacturing and equipment engineering, we invite you to apply and be part of our mission to deliver world-class solutions.
Responsibility
- Lead and manage a team of equipment engineers to ensure optimal performance of Bumping, MEOL, and CoW production lines.
- Oversee the maintenance, calibration, and troubleshooting of advanced semiconductor equipment to minimize downtime and maximize efficiency.
- Develop and implement preventive maintenance programs and standard operating procedures (SOPs) for critical equipment.
- Collaborate with cross-functional teams (process engineering, production, and quality assurance) to resolve equipment-related issues and improve yield.
- Drive continuous improvement initiatives, including equipment upgrades, automation, and process optimizations to enhance productivity and reduce costs.
- Ensure compliance with safety, environmental, and industry regulations (e.g., ISO, SEMI standards) for all equipment operations.
- Manage utility infrastructure (e.g., power, water, gas, vacuum systems) to support uninterrupted production.
- Monitor key performance indicators (KPIs) such as equipment uptime, mean time between failures (MTBF), and overall equipment effectiveness (OEE).
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Industrial Engineering, or a related field.
- Minimum 8+ years of experience in semiconductor manufacturing, with at least 3 years in a managerial role overseeing equipment engineering.
- Proven expertise in Bumping, MEOL, or CoW processes, including equipment such as wire bonders, flip-chip bonders, and wafer-level packaging tools.
- Strong knowledge of equipment maintenance, troubleshooting, and reliability engineering principles.
- Experience with utility infrastructure management (e.g., cleanroom utilities, process gases, chemical delivery systems).
- Familiarity with Lean Manufacturing, Six Sigma, or TPM methodologies is a plus.
- Excellent leadership, communication, and project management skills.
- Ability to work in a fast-paced, high-tech environment and adapt to evolving industry demands.