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Engineering 🏢 Full Time ⭐️ Terverifikasi

Equipment Engineer (Die Preparation & Reconstruction) - Semiconductor Manufacturing

Silicon Box
Badung, Bali, Indonesia
Salary Estimate
Rp 15.000.000 – Rp 25.000.000
Newest
Live Update
9 Agustus 2026
Deadline
9 Agu 2027

job description

Join Silicon Box, a leader in semiconductor innovation, as an Equipment Engineer specializing in Die Preparation and Reconstruction. In this critical role, you will ensure the seamless operation, maintenance, and optimization of advanced production equipment to support high-precision manufacturing processes.

Based in the dynamic Badung region of Bali, you’ll work in a cutting-edge facility, collaborating with cross-functional teams to drive efficiency, minimize downtime, and uphold the highest standards of quality in semiconductor production. This is a unique opportunity to contribute to groundbreaking technology while enjoying the vibrant culture and work-life balance of Bali.

If you’re a detail-oriented engineer with a passion for troubleshooting complex systems and improving operational performance, we want to hear from you!

Responsibility

  • Install, configure, and commission new production equipment, ensuring compliance with technical specifications and safety standards.
  • Perform routine and preventive maintenance on die preparation and reconstruction equipment to maximize uptime and reliability.
  • Diagnose and resolve equipment malfunctions, root-cause issues, and implement corrective actions to prevent recurrence.
  • Collaborate with production teams to optimize equipment performance, reduce cycle times, and enhance yield.
  • Develop and update standard operating procedures (SOPs), maintenance logs, and technical documentation.
  • Conduct equipment calibration, testing, and validation to ensure precision and consistency in semiconductor processes.
  • Train and mentor technicians and operators on equipment operation, safety protocols, and troubleshooting techniques.
  • Stay current with industry advancements and recommend upgrades or modifications to improve efficiency and capability.

Qualifications

  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Mechatronics, or a related field.
  • Minimum 3 years of experience in equipment engineering, preferably in semiconductor, electronics manufacturing, or precision engineering.
  • Hands-on experience with die preparation, reconstruction, or similar high-precision equipment.
  • Strong knowledge of PLC systems, pneumatics, hydraulics, and automation controls.
  • Proficiency in using diagnostic tools, schematics, and technical manuals for troubleshooting.
  • Excellent problem-solving skills with a methodical approach to equipment failures and process improvements.
  • Ability to work in a fast-paced environment, including shift work or on-call support as needed.
  • Fluency in English (written and verbal); knowledge of Indonesian (Bahasa) is a plus.

Required Skills

Equipment Maintenance Semiconductor Manufacturing Die Preparation PLC Programming Troubleshooting Preventive Maintenance Automation Mechanical Engineering Electrical Engineering Technical Documentation

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