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Engineering 🏢 Full Time ⭐️ Terverifikasi

Equipment Engineer – Chip-on-Wafer (CoW) | Advanced Semiconductor Manufacturing

STATS ChipPAC
Bali, Indonesia
Salary Estimate
Rp 18.000.000 – Rp 25.000.000
Newest
Live Update
7 Agustus 2026
Deadline
7 Agu 2027

job description

Join STATS ChipPAC, a global leader in advanced semiconductor packaging and test services, as an Equipment Engineer – Chip-on-Wafer (CoW) in the vibrant tech hub of Bali, Indonesia. In this critical role, you will oversee, maintain, and optimize cutting-edge CoW line equipment to ensure seamless production, maximize efficiency, and drive innovation in semiconductor manufacturing.

As a key member of our engineering team, you will collaborate with cross-functional teams to troubleshoot equipment issues, implement preventive maintenance strategies, and enhance process performance. This is an exceptional opportunity to work with state-of-the-art technology in a dynamic, fast-paced environment while contributing to the advancement of semiconductor solutions that power the world’s most innovative devices.

Bali offers a unique blend of professional growth and an unparalleled quality of life, with its stunning landscapes, rich culture, and thriving expat community. If you are a detail-oriented engineer with a passion for problem-solving and a drive to excel in semiconductor manufacturing, we invite you to be part of our mission to shape the future of technology.

Why Join STATS ChipPAC?

  • Work with cutting-edge semiconductor equipment and processes.
  • Collaborate with a global team of experts in a supportive and innovative environment.
  • Competitive salary and benefits package tailored for top talent.
  • Opportunities for professional development and career advancement.
  • Live and work in Bali, one of the world’s most desirable locations.

Responsibility

  • Oversee and maintain Chip-on-Wafer (CoW) line equipment to ensure optimal performance and minimal downtime.
  • Develop and implement preventive maintenance schedules to enhance equipment reliability and longevity.
  • Troubleshoot and resolve equipment-related issues, collaborating with cross-functional teams to minimize production disruptions.
  • Optimize equipment settings and processes to improve yield, efficiency, and product quality.
  • Monitor equipment performance metrics and generate reports to identify trends and areas for improvement.
  • Train and mentor junior technicians and operators on equipment operation, safety protocols, and best practices.
  • Ensure compliance with industry standards, safety regulations, and company policies.
  • Participate in continuous improvement initiatives to drive innovation and operational excellence.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Mechatronics, or a related field.
  • Minimum of 3-5 years of experience in equipment engineering, preferably in semiconductor or advanced manufacturing environments.
  • Hands-on experience with Chip-on-Wafer (CoW) or similar semiconductor equipment (e.g., die attach, bonding, or inspection tools).
  • Strong troubleshooting skills and proficiency in diagnosing mechanical, electrical, or software-related equipment issues.
  • Familiarity with preventive maintenance programs, SPC (Statistical Process Control), and lean manufacturing principles.
  • Experience with automation, robotics, or Industry 4.0 technologies is a plus.
  • Excellent communication skills in English, with the ability to collaborate effectively with global teams.
  • Certifications in equipment maintenance, safety (e.g., OSHA), or semiconductor processes are advantageous.

Required Skills

semiconductor equipment maintenance Chip-on-Wafer (CoW) processes troubleshooting preventive maintenance SPC lean manufacturing automation robotics equipment optimization cross-functional collaboration technical reporting safety compliance

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