job description
Join STATS ChipPAC, a global leader in advanced semiconductor packaging and test solutions, as an Equipment Engineer – Bumping in our state-of-the-art facility in Badung, Bali. This role is pivotal in ensuring the seamless operation of our semiconductor manufacturing processes, with a focus on Bumping equipment maintenance, optimization, and qualification.
As an Equipment Engineer, you will play a critical role in maintaining the reliability and efficiency of our production tools, executing preventive maintenance, and leading tool qualification initiatives. Your expertise will directly impact the quality and yield of our semiconductor products, contributing to our mission of delivering cutting-edge solutions to the global market.
This is an exceptional opportunity for a detail-oriented engineer with a passion for semiconductor technology to grow their career in a dynamic, innovative environment. If you thrive in a collaborative setting and are eager to make a tangible impact, we invite you to apply and become part of our world-class team.
Responsibility
- Manage and maintain Bumping process equipment to ensure optimal performance and minimal downtime.
- Execute preventive maintenance schedules and troubleshoot equipment issues to maintain production efficiency.
- Lead tool qualification processes, including equipment setup, calibration, and validation to meet industry standards.
- Collaborate with cross-functional teams to resolve technical challenges and improve equipment reliability.
- Monitor equipment performance metrics and implement corrective actions to enhance productivity.
- Document maintenance activities, equipment status, and performance data for compliance and reporting.
- Train and mentor junior engineers and technicians on equipment operation and maintenance best practices.
- Stay updated with the latest advancements in semiconductor manufacturing technology and recommend process improvements.
Qualifications
- Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related field.
- Minimum of 3 years of experience in semiconductor equipment maintenance, preferably in Bumping processes.
- Strong knowledge of semiconductor manufacturing equipment, including troubleshooting and preventive maintenance.
- Experience with tool qualification, calibration, and validation processes.
- Familiarity with industry standards such as ISO, SEMI, and other relevant certifications.
- Excellent problem-solving skills and the ability to work under pressure in a fast-paced environment.
- Strong communication and teamwork skills to collaborate effectively with cross-functional teams.
- Willingness to work in shifts and adapt to evolving production demands.