job description
Join Ambition Group Singapore as our Director of Thin Film Module Engineering and lead cutting-edge semiconductor innovation from the tropical paradise of Bali! This is a rare opportunity to shape the future of 300mm thin film technology while enjoying Indonesia's most vibrant tech hubs, including Canggu, Ubud, and Denpasar.
As the technical visionary for our thin film module division, you'll oversee a world-class engineering team developing next-generation semiconductor processes. Your leadership will directly impact the performance, yield, and reliability of advanced memory and logic devices, positioning our company at the forefront of the global semiconductor industry.
This role offers the perfect blend of professional challenge and lifestyle benefits. Work with state-of-the-art 300mm fabrication equipment while enjoying Bali's unparalleled work-life balance, with easy access to world-class beaches, cultural experiences, and a thriving expat community. Our flexible hybrid work model allows you to balance high-impact engineering leadership with the island's natural beauty.
We're seeking a strategic leader with deep technical expertise in thin film deposition, process integration, and semiconductor manufacturing. If you're passionate about pushing the boundaries of semiconductor technology while working in one of the world's most desirable locations, this is your chance to make a global impact from paradise.
Why join us?
- Lead groundbreaking semiconductor projects with global significance
- Competitive compensation package with relocation assistance
- Flexible hybrid work model in Bali's most desirable locations
- Work with cutting-edge 300mm semiconductor technology
- Be part of a growing team in Indonesia's emerging tech ecosystem
- Comprehensive benefits including health insurance and professional development
Responsibility
- Lead the strategic direction and technical roadmap for 300mm thin film module development
- Oversee process integration, yield improvement, and reliability engineering for advanced semiconductor devices
- Manage cross-functional teams including process engineers, equipment engineers, and integration specialists
- Drive continuous improvement in thin film deposition techniques (PVD, CVD, ALD) and metrology
- Collaborate with global R&D teams to implement next-generation semiconductor technologies
- Establish and maintain key performance metrics for thin film module performance and manufacturing efficiency
- Mentor and develop engineering talent while fostering a culture of innovation and technical excellence
- Represent the company at industry conferences and technical forums to showcase our technological leadership
Qualifications
- Master's or PhD in Materials Science, Electrical Engineering, Physics, or related field
- 10+ years of experience in semiconductor thin film engineering, with at least 5 years in a leadership role
- Proven track record in 300mm semiconductor manufacturing and process integration
- Deep expertise in thin film deposition techniques (PVD, CVD, ALD) and characterization methods
- Strong background in semiconductor device physics and process-flow optimization
- Experience with statistical process control (SPC) and design of experiments (DOE)
- Excellent leadership skills with experience managing cross-functional engineering teams
- Fluency in English; additional languages (Bahasa Indonesia, Mandarin) are a plus