job description
Join Renesas Electronics, a global leader in semiconductor solutions, as the Director of Semiconductor IC Packaging Assembly Operations. In this pivotal role, you will spearhead high-volume semiconductor assembly operations, driving innovation, efficiency, and excellence in our state-of-the-art facilities. Based in the vibrant regions of Bali, you will lead a dynamic team to ensure seamless production, quality control, and operational excellence in semiconductor packaging.
This is a unique opportunity to shape the future of semiconductor manufacturing while enjoying the unparalleled work-life balance that Bali offers. If you are a strategic leader with a passion for semiconductor technology and operational excellence, we invite you to apply and be part of our mission to deliver cutting-edge solutions to the global market.
Responsibility
- Lead and oversee high-volume semiconductor IC packaging assembly operations, ensuring adherence to quality, safety, and efficiency standards.
- Develop and implement strategic operational plans to optimize production processes, reduce costs, and enhance productivity.
- Collaborate with cross-functional teams, including R&D, engineering, and supply chain, to drive innovation and continuous improvement.
- Ensure compliance with industry regulations, environmental standards, and company policies in all operational activities.
- Manage and mentor a high-performing team, fostering a culture of accountability, collaboration, and excellence.
- Monitor key performance indicators (KPIs) and implement corrective actions to meet operational and financial targets.
- Drive the adoption of advanced manufacturing technologies and automation to enhance operational capabilities.
- Represent the company in industry forums, conferences, and customer engagements to strengthen partnerships and business opportunities.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Industrial Engineering, or a related field.
- Minimum of 10 years of experience in semiconductor manufacturing, with at least 5 years in a leadership role.
- Proven track record in managing high-volume semiconductor assembly operations, including packaging and testing.
- Strong knowledge of semiconductor manufacturing processes, equipment, and quality control systems.
- Excellent leadership, communication, and interpersonal skills to effectively manage teams and stakeholders.
- Experience with Lean Manufacturing, Six Sigma, or other continuous improvement methodologies.
- Familiarity with industry standards such as ISO, IPC, and JEDEC.
- Ability to thrive in a fast-paced, dynamic environment and drive results under pressure.