job description
Join PCL International Technologies as a Senior Die Bond Engineer and play a pivotal role in advancing semiconductor manufacturing processes in our state-of-the-art facility in Badung, Bali. This is a unique opportunity to contribute to cutting-edge technology in Die Attach, Wire Bonding, OGP Measurement, Plasma Cleaning, and Laser Cutting, ensuring optimal performance and reliability in front-end semiconductor production.
As a key member of our engineering team, you will drive process improvements, troubleshoot technical challenges, and collaborate with cross-functional teams to enhance efficiency, yield, and product quality. Your expertise will directly impact the scalability and innovation of our semiconductor solutions, positioning you at the forefront of the industry.
If you are passionate about precision engineering, process optimization, and working in a dynamic, high-tech environment, we invite you to apply and help shape the future of semiconductor manufacturing.
Responsibility
- Lead the development, optimization, and maintenance of Die Attach and Wire Bonding processes to ensure high yield and reliability.
- Conduct OGP (Optical Gauging Profile) Measurements and analyze data to identify deviations and implement corrective actions.
- Oversee Plasma Cleaning and Laser Cutting operations, ensuring adherence to quality standards and process specifications.
- Collaborate with R&D and production teams to troubleshoot process-related issues and propose innovative solutions.
- Develop and document standard operating procedures (SOPs) for semiconductor front-end processes.
- Monitor equipment performance, conduct preventive maintenance, and coordinate with vendors for upgrades or repairs.
- Train and mentor junior engineers and technicians on best practices in die bond and semiconductor processes.
- Stay updated with industry trends and emerging technologies to drive continuous improvement in manufacturing efficiency.
Qualifications
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
- Minimum 5 years of experience in semiconductor manufacturing, with a focus on Die Attach, Wire Bonding, or similar front-end processes.
- Hands-on experience with OGP Measurement tools, Plasma Cleaning systems, and Laser Cutting equipment.
- Strong analytical and problem-solving skills, with the ability to interpret complex data and implement process improvements.
- Proficiency in statistical process control (SPC) and Design of Experiments (DOE) methodologies.
- Excellent communication and teamwork skills, with the ability to collaborate across multidisciplinary teams.
- Familiarity with ISO 9001, IATF 16949, or other quality management systems is a plus.
- Willingness to work in Badung, Bali and adapt to a fast-paced, high-precision manufacturing environment.