Beranda Job Details
M
Engineering 🏢 Full Time ⭐️ Terverifikasi

Senior Manager, Package PE, Product and System Engineering (High Bandwidth)

Micron Semiconductors
Canggu, Ubud, Denpasar, Jimbaran, Nusa Dua, Kuta, Badung
Salary Estimate
USD 120.000 – USD 180.000
Newest
Live Update
19 Juli 2026
Deadline
19 Jul 2027

job description

Join Micron Semiconductors as a Senior Manager in Package PE, Product and System Engineering and lead groundbreaking innovations in high-bandwidth semiconductor solutions. Based in the vibrant tech hubs of Bali, you'll drive technical excellence, mentor high-performing teams, and shape the future of semiconductor packaging and system integration.

This role offers a unique opportunity to work at the intersection of product engineering and system architecture, ensuring Micron's leadership in next-gen memory and storage technologies. Collaborate with global teams, leverage cutting-edge tools, and contribute to projects that redefine industry standards.

Why Bali? Enjoy a dynamic work-life balance in one of the world's most inspiring locations, with flexible remote/hybrid options and access to Micron's global resources.

Responsibility

  • Lead cross-functional teams in developing high-bandwidth semiconductor packaging solutions.
  • Drive product engineering strategies from concept to mass production.
  • Collaborate with R&D, manufacturing, and quality teams to optimize system performance.
  • Oversee technical roadmaps for next-gen memory and storage products.
  • Mentor engineers and foster a culture of innovation and continuous improvement.
  • Ensure compliance with industry standards and regulatory requirements.
  • Partner with global stakeholders to align product engineering with business goals.
  • Identify and mitigate risks in packaging and system integration processes.

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Materials Science, or related field.
  • 10+ years of experience in semiconductor packaging, product engineering, or system integration.
  • Proven leadership in managing technical teams and complex projects.
  • Deep expertise in high-bandwidth memory (HBM), DRAM, or NAND technologies.
  • Strong analytical and problem-solving skills with a data-driven mindset.
  • Excellent communication and stakeholder management abilities.
  • Experience with DFM (Design for Manufacturing) and yield optimization.
  • Familiarity with industry tools (e.g., ANSYS, COMSOL, or similar).

Required Skills

semiconductor packaging product engineering system integration high-bandwidth memory team leadership DFM yield optimization ANSYS COMSOL

Ready to Take This Challenge?

Make sure your resume is ready. Submit your application now before the deadline..

Apply Now

Lowongan Terkait

Rekomendasi pekerjaan serupa untuk Anda

Lihat Semua