job description
Join Micron Semiconductors as a Principal Engineer in HBM Product System Engineering, where youâll lead the innovation of next-generation High Bandwidth Memory (HBM) solutions for media and health technology applications. In this pivotal role, youâll drive technical excellence in product quality, cost optimization, and scalability, shaping the future of memory solutions that power cutting-edge devices in healthcare, AI, and high-performance computing.
Based in the vibrant tech hub of Bali, Indonesia, youâll collaborate with cross-functional teams to deliver groundbreaking HBM architectures, ensuring Micron remains at the forefront of semiconductor innovation. This is a unique opportunity to combine technical leadership with strategic vision in a role that directly impacts global technology advancements.
Micron offers a dynamic work environment, competitive compensation, and the chance to work on projects that redefine industry standards. If youâre a seasoned engineer with a passion for system-level problem-solving and a track record of delivering high-impact solutions, we want to hear from you.
Responsibility
- Technical Leadership: Spearhead the design, development, and optimization of HBM product systems for media and health applications, ensuring alignment with Micronâs strategic goals.
- System Architecture: Define and refine HBM system architectures, balancing performance, power efficiency, and cost-effectiveness.
- Cross-Functional Collaboration: Partner with R&D, manufacturing, and quality teams to integrate system-level requirements into product roadmaps.
- Quality & Reliability: Drive initiatives to enhance product reliability, yield, and testability through rigorous analysis and validation.
- Cost & Scalability: Identify opportunities to reduce production costs while maintaining high performance and scalability for mass-market deployment.
- Innovation & IP: Contribute to patentable innovations and proprietary technologies that strengthen Micronâs competitive edge in HBM.
- Customer Engagement: Work closely with key clients and partners to understand market needs and translate them into technical specifications.
- Mentorship: Guide and mentor junior engineers, fostering a culture of technical excellence and continuous learning.
Qualifications
- Education: Masterâs or PhD in Electrical Engineering, Computer Engineering, or related field with a focus on semiconductor systems or memory technologies.
- Experience: 10+ years in system engineering, HBM, DRAM, or memory product development, with at least 5 years in a leadership role.
- Technical Expertise: Deep understanding of HBM architectures, high-speed interfaces, signal integrity, and power delivery networks (PDN).
- Problem-Solving: Proven ability to tackle complex system-level challenges with data-driven, innovative solutions.
- Industry Knowledge: Familiarity with media processing, AI/ML workloads, or healthcare applications of memory technologies.
- Tools & Methodologies: Proficiency in system modeling tools (e.g., SPICE, Verilog-A), simulation software, and statistical analysis.
- Soft Skills: Exceptional communication, stakeholder management, and team leadership abilities.
- Language: Fluent in English (written and verbal); additional languages are a plus.